Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies

Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies

Bibliographic Details
Main Author: Mohammadi Panah, Mahshid
Format: Others
Language:English
Published: Blekinge Tekniska Högskola, Institutionen för maskinteknik 2014
Subjects:
Area array flip chip
Gold bump joint
Thermal mismatch
Thermo mechanical failure
Online Access:http://urn.kb.se/resolve?urn=urn:nbn:se:bth-10918
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spelling ndltd-UPSALLA1-oai-DiVA.org-bth-109182015-11-06T05:02:58ZThermo-mechanical Analysis of Bump Joints for Packages in Flip Chip AssembliesengMohammadi Panah, MahshidBlekinge Tekniska Högskola, Institutionen för maskinteknik2014Area array flip chipGold bump jointThermal mismatchThermo mechanical failureStudent thesisinfo:eu-repo/semantics/bachelorThesistexthttp://urn.kb.se/resolve?urn=urn:nbn:se:bth-10918application/pdfinfo:eu-repo/semantics/openAccess
collection NDLTD
language English
format Others
sources NDLTD
topic Area array flip chip
Gold bump joint
Thermal mismatch
Thermo mechanical failure
spellingShingle Area array flip chip
Gold bump joint
Thermal mismatch
Thermo mechanical failure
Mohammadi Panah, Mahshid
Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies
author Mohammadi Panah, Mahshid
author_facet Mohammadi Panah, Mahshid
author_sort Mohammadi Panah, Mahshid
title Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies
title_short Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies
title_full Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies
title_fullStr Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies
title_full_unstemmed Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies
title_sort thermo-mechanical analysis of bump joints for packages in flip chip assemblies
publisher Blekinge Tekniska Högskola, Institutionen för maskinteknik
publishDate 2014
url http://urn.kb.se/resolve?urn=urn:nbn:se:bth-10918
work_keys_str_mv AT mohammadipanahmahshid thermomechanicalanalysisofbumpjointsforpackagesinflipchipassemblies
_version_ 1718126166535045120

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