Thermo-mechanical Analysis of Bump Joints for Packages in Flip Chip Assemblies
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| Format: | Others |
| Language: | English |
| Published: |
Blekinge Tekniska Högskola, Institutionen för maskinteknik
2014
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| Subjects: | |
| Online Access: | http://urn.kb.se/resolve?urn=urn:nbn:se:bth-10918 |
| Description not available. |