Copper metallization in supercritical carbon dioxide: Applications and kinetics
Copper is the material of choice for advanced interconnects due to its low electrical resistance and superior electromigration resistance. However, as feature sizes are reduced in successive generations, the difficulty of filling high aspect ratio feature increases rapidly. Supercritical Fluid Depos...
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| Language: | ENG |
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ScholarWorks@UMass Amherst
2005
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| Online Access: | https://scholarworks.umass.edu/dissertations/AAI3163722 |