Process engineering of thick dielectric films by Chemically Bonded Composite Sol-Gel
This research explores new processing methods to decrease residual stress in ceramic films on metallic substrates, and thus to prevent large-scale cracking in the films. The system of particular concern is alumina-based ceramic coating on aluminum alloy, wherein coefficient of thermal expansion (CTE...
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| Language: | English |
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University of British Columbia
2011
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| Online Access: | http://hdl.handle.net/2429/31084 |