| Summary: | 碩士 === 國立臺北科技大學 === 分子科學與工程系有機高分子碩士班 === 107 === In this study, we used two kind of -CF3 containing monomers,4,4-(Hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 2,2-bis(trifluoromethyl)benzidine (TFMB) to synthesize the poly (amide acid) (PAA) solution, the precursor of polyimide (PI).Then, coupling agent was added into the above solution under stirring for 6 hours. Through sol-gel of (3-amino-propyl)triethoxysilane (APrTEOS) or tetraethoxysilane (TEOS), the PAA-silica solution was obtained. Finally, the mixture was casted on the glass substrate and then thermally imidized by stepwise heating to obtain the PI-silica composite. In this study, we investigated the properties of PI-silica composite with different coupling agent and sol-gel solutions.
Silica was added into the PI to improve its thermal property . The coupling agent can further improve the dispersion of silica in the PI composites to make it still highly transparent.
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