Patent Analysis of Low Melting Point Polyamide Of Hot Melt Adhesive

• Main Authors: WU, PEI-YING, 吳沛盈
• Other Authors: RWEI, SYANG-PENG
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/3j53a9

碩士 === 國立臺北科技大學 === 分子科學與工程系有機高分子碩士班 === 107 === Polyamide, also known as nylon, was originally an important synthetic fiber raw mate-rial before it developed into engineering plastics. It is also the earliest engineering plastics. It has unique wear resistance, good friction coefficient, and excellent heat and impact re-sistance. It is widely used in textiles, shoe materials, automotive and aerospace parts, and industrial materials. This research uses the patent hierarchy search method to retrieve the technical charac-teristics of low melting point polyamines hot melt adhesive, and then analyzes the synthesis technology of low melting point polyamines hot melt adhesive materials by using the pa-tented power matrix analysis. Specifically, the research of this study The purpose is to hope that the industry will further improve the current status and trends of low melting point pol-yamines hot melt adhesive materials through patent analysis, and as a follow-up technology research and development, innovation or avoidance of design data sources, to break through patent barriers, create technological innovation, and then enhance Industrial competitive-ness.