Effect of Preparation Methods of Copper Pillar on Interface Properties of Solder Joints
碩士 === 國立臺北科技大學 === 材料科學與工程研究所 === 107 === With the rapid development of technology and the miniaturization of electronic components, the size of solder joints continue to shrink. The reliability of electronic components are receiving more attention. Any microscopic defect occurring at the interface...
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| Format: | Others |
| Language: | zh-TW |
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2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4r6kqg |