Research on the Dissipation Ability of Electrostatic Protection for IC Sealing and Testing Process
碩士 === 國立虎尾科技大學 === 光電工程系光電與材料科技碩士班 === 107 === Electrostatic damage (ESD) is an abnormal phenomenon which happens frequently in IC package process. Also, it is difficult to find out. Most of the ESD phenomena are found through a series of testing in the later process. Even some of them was due to t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4294vb |