Study on Electroplating Copper by Citric Acid Additives

碩士 === 國立聯合大學 === 化學工程學系碩士班 === 107 === In recent years, as the development of electroplating technology has become more mature, the competition among various manufacturers is mainly in the types of additives and the proportion of additions. In the electroplating industry, the types of additives hav...

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Bibliographic Details
Main Authors: HSUEH,YUN-I, 薛昀伊
Other Authors: YANG,WEN-PIN
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/eqg2f7
Description
Summary:碩士 === 國立聯合大學 === 化學工程學系碩士班 === 107 === In recent years, as the development of electroplating technology has become more mature, the competition among various manufacturers is mainly in the types of additives and the proportion of additions. In the electroplating industry, the types of additives have been roughly the same. Take inhibitors as an example: most of the manufacturers use polyethylene glycol as its selling price is high; however, polyethylene glycol is a polymer, and it is easy to pollute the environment. In this experiment, citric acid was used as an additive by replacing the more expensive polyethylene glycol with a cheaper and more environmentally friendly citric acid. In order to test the feasibility of alternatives by using citric acid as a substitute for polyethylene glycol, Linear Sweep and Cyclic Voltametry analysis had to be done with stainless steel sheets for physical plating. The experiment was divided into two stages. The first stage was to understand the influence of electrochemical analysis on the operating environment with changing concentration, pH and temperature through Cyclic Linear Sweep Voltammetry (CLSV). The second stage was with the result of electro analysis to change the current density and the plating time. The copper film was deposited on the stainless steel sheet by physical plating. When the basic liquid contains only citric acid, the results of the electroplating analysis have an inhibitory effect, but the effect is changed depending on the pH value and the concentration, and the physical plating is bright orange and slightly lustrous. When the basic liquid contains only chloride ions, the electro analytical results are promoted, and the solid plating is a bright orange uniform copper film. The basic solution contains both citric acid and chloride ions. Electrochemical analysis shows that the two have synergistic effects. The change in pH value and the concentration of chloride ions will affect the synergy. The electroplating quality of the physical plating increases with the increase of citric acid concentration.