A Study of Patent Strength for Competitors on Powders of Additive Manufacturing

• Main Authors: Bo-En Zhu, 朱伯恩
• Other Authors: Kuo-tsan Liu
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/rrs9mm

碩士 === 國立臺灣科技大學 === 專利研究所 === 107 === Additive manufacturing (3D printing) is one of the most attractive industries in the world. The main development direction currently can be divided into two parts -Machine’s structure and Materials, like as traditional printer. The main source of profit for the printers is the sale of ink, as well as the 3D printing. However, in the past, 3D printing technology mainly stayed in individual users for producing sample products. With the advancement of science and technology and the expiration of basic patents, the development of 3D printing is moving towards industrial production. Therefore, this study will conduct the following analysis for patents related to 3D printing powder materials related to industrial mass production: (1) Analyzing the patent of 3D Printing powder materials in the overall patent trends of various countries, in order to know the wide range of patent application trends, competing companies, and material types. (2) Analyzing important material types in major developing countries, define technologies and functions, and classify patents, and draw technical power matrix diagrams to find technical gaps. (3) Performing patent strength analysis on the basis of the competition company to find out the competition company with the highest patent value. (4) Combined with the current cooperation information of the manufacturers on the market and the aforementioned analysis results, which will be substantive for R&D and future planning The results of this paper are as follows: (1) These patents for plastic materials have been dominated by major patentees, and it is recommended to go to other special functions or develop composite polymer materials; 3D printing of industrial plastics led by Hewlett Packard is currently taking the lead. EOS and 3D Systems, which were originally developed in the early years, are slightly behind the layout. (2) Compared with other plastics and metal materials, adhesives are more worthy of research and development; it is estimated that HP will cooperate with 3D printing plastic materials manufacturers in the future, and may follow the same model in the future and directly seek cooperation with metal materials developers. EPSON and RICOH may be mainly printed in ceramic or metal materials in the future, and other special materials such as glass may be in the future 3D printing manufacturing range. (3) These patent layout of metal materials is beginning. It is in the state of research and development by many manufacturers. It is suggested that the research and development can be carried out from the nodes with less power matrix layout. 3D printing products in the aviation field have begun to form patents barrier through patent cooperation.