Optimization Strategies for Integer Linear Programming Based Ball Grid Array Substrate Router
碩士 === 國立臺灣科技大學 === 資訊工程系 === 107 === As the rapidly growing demand for system-level integration, package substrates has become one of the most important carriers in semiconductor industry. Fine pitch ball grid array (FBGA) packaging is a widely used technology thanks to its relative cost-effectiven...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/6npe46 |