Integer Linear Programming Based Substrate Routing Framework for Fine Pitch Ball Grid Array Package
碩士 === 國立臺灣科技大學 === 資訊工程系 === 107 === In advanced very-large-scale integration (VLSI) design, billions of transistors could be fabricated on the same die. Integration circuit (IC) packaging has become one of the most important steps in IC design flow. Fine pitch ball grid array (FBGA) is widely used...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2019
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/eea4e9 |