Development of Multiple Image Fusion and Stitching Procedure for PCB

• Main Authors: YI-CHU KO, 柯羿竹
• Other Authors: Hung-Fei Kuo
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/8t47s6

碩士 === 國立臺灣科技大學 === 自動化及控制研究所 === 107 === Printed circuit board (PCB) play an important role in the electronics industry. In advanced inspection, efficient and reliable image visual inspection is the most important part of machine vision-based automated optical inspection (AOI). Image sharpness is the key detection standard. Using image fusion to improve the image sharpness during the inspection process in order to reduce the rework rate and increase the yield. Image stitching has lots of advantage, capture every region of the PCB and reunion them is one of the advantages. In addition, due to the Depth of Focus (DOF) limitation of the optical lens, each region of the PCB will be clearly imaged only when it is captured within the depth of focus limit otherwise will a blur. Therefore, the existing CCD is not easy to capture clear images of all areas of the complete PCB, so the multi-focus image fusion technology proposed in this thesis can solve this problem by merging multiple images within the same scene and different depths into one image. The image fusion method proposed in this thesis uses a multi-focus image fusion method of image sharpness capture and PCB for images segmentation and compares the image sharpness with the traditional image fusion performance map. First of all, classified three different types of PCB and segment these images of PCB which shared with the same scene but different depths of the focus. And classified the image region depends on image sharpness. After that, select the best image sharpness in this region and merge them shown in the result of the experiment. The proposed method can improve the limitation of the traditional image fusion technology and a small number of image fusion, and effectively enhance the sharpness of the image, further improve the image quality of each block of the PCB, and merge the image of each PCB region into a complete image by using image stitching technology.