| Summary: | 碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 107 === With the development of green energy industry and electric car, the electric package technology of high power module must process high reliability and high heat dissipation. In recent years, Silver-Palladium Alloy material has been developed to alternate the Gold, Aluminum, and Copper wires. During the operation of electronic devices, the high current flow might cause failures. The characteristics of Ag-Pd alloy such as low cost, low electrical resistivity, high electromigration durability will enhance the reliability of the device and will solve the problems. Ultrasonic wire bonding has been a predominant interconnection technique in microelectronic packaging industry.
In this research, Ag-4Pd Alloy ribbons and Pure Copper ribbons will be bonded on various direct bond copper substrates such as CuNiAu, CuNiPdAu, CuNi, CuNiPd, and OSP/Cu Substrates. The reliability test will be hold after the bonding process. This research includes 5 stages: 1) Ultrasonic Bonding, 2) Pull Strength Test, 3) Interface Analysis, 4) Residual Area Counting with MATLB, 5) Failure mode analysis and 6) 150, 1000HR High Temperature Storage Test. Throughout a series of experiment, the best choice of substrates correspond to theses two ribbons will be found.
Throughout the research, the best substrate for Ag-4Pd Alloy ribbons and Pure Copper ribbons are CuNiPdAu substrate and OSP/Cu substrate. In conclusion, MATLAB is a useful way in counting the residual area, and the bonding strength is highly related to the residual area. In the reliability test, the increment of the grain boundary at the interface cause the enhancement of the diffusion rate of solid solution. Under the 150、1000hrs high temperature storage test, the ultrasonic bonding with the substrate which contain Au layer have high reliability no matter in Ag-4Pd Alloy ribbons or Pure Copper ribbons.
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