Probing Analysis of the Cantilever Probe in Voltage after Heat Treatment

碩士 === 國立高雄科技大學 === 模具工程系 === 107 === In wafer packaging process, a probe needle is used to gauge electrical contacts on the wafer and to check the condition of the electrical properties. The process, however, if done incorrectly, may affect the service life of the probe needle and may lead to damag...

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Bibliographic Details
Main Authors: Hong,Ci-Chuan, 洪啟銓
Other Authors: Chang,Kao-Hua
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/3t9kru