| Summary: | 碩士 === 國立高雄科技大學 === 模具工程系 === 107 === In wafer packaging process, a probe needle is used to gauge electrical contacts on the wafer and to check the condition of the electrical properties. The process, however, if done incorrectly, may affect the service life of the probe needle and may lead to damage to the wafer being tested. Thus, lowering the product yield in the process.
In this paper, probe experiment is conducted using tungsten-rhenium cantilever probe needle after it underwent bending and annealing treatment at 800 degrees Celsius with voltage and current module applied. The results are examined. First, probe needles with diameters of 100μm, 200μm, and 300μm were tested for current resistance to find the maximum current threshold. 17%, 25%, and 35% of the maximum threshold current were applied as fatigue test for the needle. The test stroke is set to 75μm to observe the probe tip displacement and its reaction force when numbers (N) are 0, 1k, 5k, 10k, 30k, 50k, 100k, 300k, 500k, 750k, 1000k and 1250k. When the probe is fatigue-damaged during the test, the number of probes (N) is recorded as the fatigue life. Finally, the trial results are integrated and the relevant relationship equations are established.
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