Improvement of Temperature Control Efficiency of Handler

• Main Authors: SHEN, YIN-CHI, 沈胤錡
• Other Authors: CHENG, PING-SHOU
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/ue8zgr

碩士 === 國立高雄科技大學 === 電子工程系 === 107 === In the age of advancement of science and technology, there are lots of high-technology products around us. The next generation communication technology-5G, which has a slogan that everything can be connected. The most important part in these technology products is IC. When the Wafer be produced from fab, that would be transferred to packaging and testing plant, cutting the wafer, packing the products, and then execute the electronic testing. While in the electronic testing, the requirement of temperature is different depends on various kind of IC, if the IC core temperature is affected by outside environment, the test result may be changed, that is a big problem about testing yield. In the past, the IC test handler temperature adjustment is done manually, but that is waste a lot of time and energy because of lots of handler, and there is a risk of out of control because human decision. In order to avoid these problems, by developing automatic program with C# language, using FTP(File Transfer Protocol) to capture IC core temperature regularly, and Insert to Database by SQL command, and send to handler with TCP Socket after calculating best finetune offset. The enhanced result saves amount of 600 hours working time on adjustment the temperature offset on handler and lower the cost on production, an amount of 3.6 million NTD.