The Study of Chemical Dipping De-flash Process on Exposed Die Paddle Delamination for Quad Flat Package (QFP)
碩士 === 國立高雄科技大學 === 化學工程與材料工程系 === 107 === This study investigated the delamination between the exposed die paddle and the molding compound of the Quad Flat Package (QFP) exposed wafer holder product of the IC packaging factory. The purpose of this study is to investigate the effect of different typ...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/cr6nqu |