| Summary: | 碩士 === 國立高雄科技大學 === 化學工程與材料工程系 === 107 === This study investigated the delamination between the exposed die paddle and the molding compound of the Quad Flat Package (QFP) exposed wafer holder product of the IC packaging factory.
The purpose of this study is to investigate the effect of different types of syrup on the delamination of different syrup bases (inorganic-based and solvent types). The experimental results show that QFP products only use inorganic alkali to remove the glue process, within the normal operating parameters, no matter how there is a risk of delamination in the adjustment. However, there is a phenomenon that the lower the temperature and the immersion temperature, the less the delamination ratio, but the relative ability of the glue removing decreases. When the current process overflows, the appearance of the product is not accompanied by abnormal appearance. Therefore, it is sought to use a non-inorganic base to remove the glue, that is, to replace the inorganic alkali degumming water with a solvent-type degumming water, and it is desirable to have the same degumming ability and prevent the delamination of the exposed wafer holder and the colloid. The results of the study confirmed that the solvent-based degumming water did not delaminate in any parameter combination and reliability test.
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