Optimization of the Feed Rate Parameter for 2.5 Dimensional IC Grinding Process
碩士 === 國立彰化師範大學 === 電機工程學系 === 107 === With the rise of 3D IC 2.5D IC and high-end products, Moore’s Law is a major breakthrough in key technologies. From silicon wafer to singulation a series of processes are required. Among them, wafer grinding is a destructive process which has a great influence...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/csr8g8 |