Optimization of the Feed Rate Parameter for 2.5 Dimensional IC Grinding Process

• Main Authors: Chen,Zhen-Xiu, 陳振修
• Other Authors: Lin, Der-Yun
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/csr8g8

碩士 === 國立彰化師範大學 === 電機工程學系 === 107 === With the rise of 3D IC 2.5D IC and high-end products, Moore’s Law is a major breakthrough in key technologies. From silicon wafer to singulation a series of processes are required. Among them, wafer grinding is a destructive process which has a great influence on the quality of the wafer. As the yield of the process increases, Customers are still not satisfied with this, Expecting by higher expectations and demand from customers what are the high production capacity and high demand. This paper will discuss the optimization of mechanical grinding parameters to improve the production value (Unit Per Hour, UPH). In this study, the different feed rate of grinding(Z1) were used to investigate the quality of the project after verification such as thickness control, surface roughness, (Total Thickness Variation, TTV), wafer broken, processing damage: Chip Crack, wafer burn or abnormal scratches on wafers. The result shows that increasing 125% P2 feed rate of Z1 wheel will get better TTV, but there is no benefit on UPH improvement. Moreover, it can gain better TTV and more 50% UPH enhancement by increasing 200% P1 feed rate of Z1 wheel