Optimization of Silver Alloy Wire Bonding Parameters for IC Process
碩士 === 國立彰化師範大學 === 電機工程學系 === 107 === This paper is for the wire bonding technology of IC packaging industry research. Base on the research of metal wire material components and the study of wire bonding parameters, the silver alloy wire were designed to meet the requirements of electrical performa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/h9w843 |