Optimization of Silver Alloy Wire Bonding Parameters for IC Process

• Main Authors: Yang,Yen-Lu, 楊寅鑪
• Other Authors: Chen,Liang-Rui
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/h9w843

碩士 === 國立彰化師範大學 === 電機工程學系 === 107 === This paper is for the wire bonding technology of IC packaging industry research. Base on the research of metal wire material components and the study of wire bonding parameters, the silver alloy wire were designed to meet the requirements of electrical performance and reliability. To prevent the formation of intermetallic compound growing too fast ,the special element indium was added to the 98% silver alloy in this experiment. This additive would solve the reliability issue. The indium added 98% silver wire with the optimal parameters would enhance the product quality and reach the demand for mass production. The experimental results and reliability test results such as temperature cycling test, highly accelerated stress test, and high-temperature storage life show that intermetallic compound growing rate meets the automotive electrical standards.