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碩士 === 國立中央大學 === 環境工程研究所在職專班 === 107 === CMP(chemical mechanical polishing) is an important process in semiconductor industry. Both of polishing slurry and post cleaning result in high turbidity of CMP wastewater. CMP particles are in nano scale and have high zeta potentials, which are difficult to...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/pna4q8 |