Adhesion Properties of Polyimide for Metal/Polymer Hybrid Bonding and Copper Electroplating in 3D Integration
碩士 === 國立交通大學 === 國際半導體產業學院 === 107 === With the development of the Moore’s law, three-dimensional integrated circuits (3D ICs) play an important role by simplifying the packaging structure, utilizing the heterogeneous integration, and realizing the low RC delay in the semiconductor fabrication. Esp...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/4sb48q |