Improvement of Solder Cap Deformation in Flip-Chip Packaging Process
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 107 === To optimize operation performance and improve heat dissipation, more and more high performance integrated circuit (IC) chips are fabricated with flip chip land grid array (FCLGA) packaging technology. FCLGA without solder balls is usually designed to hav...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/r9328h |