Study eductor plating by using Taguchi Method
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 107 === Abstract Electronic components miniaturization process now, passive component also need to enter the miniature field with active IC, And the key factor that control passive components following the miniaturization process is electroplating. Therefore, ho...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/789r52 |