Reduction of Metal to Metal Crack by Optimization of Dielectric Deposition Processes
碩士 === 國立交通大學 === 理學院應用科技學程 === 107 === In this work we report increase in the thickness of the metal layer for passivation crack issue, which resulted from the crack issue between the metal and the metal due to the stress mismatch between the tensile stress and the compressive stress of the film. F...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/u2dp8u |