| Summary: | 碩士 === 國立交通大學 === 管理學院高階主管管理碩士學程 === 107 === Semiconductor micro-pollution prevention has only begun in the past decade because of the continuous improvement and improvement of processes (from 65 nm, 40/45 nm, 28 nm, 1× nm, to today's 7 nm, 5 nm and future 3 nm processes). Not only an important topic of concern, but also because of the rising awareness of environmental protection, the manufacturing side has paid more attention to this issue of pollution prevention. Micro-pollution prevention refers to molecular pollution in the semiconductor process. It is also often because during the wafer manufacturing process, the process gas supply is too much or too little, the reflection time is too long or too short, and the quality of the cavity vacuum control during the process. The problem, in addition to the quality of the wafer loading cassette (FOUP) maintenance and the maintenance of cleanliness will affect the yield of the final wafer. However, during the entire semiconductor manufacturing process, how did P company enter the semi-conducting wafer foundry or DRAM manufacturing plant with a non-primary production equipment role, and then gain recognition and win a place, and then assist the semiconductor manufacturing plant. Wafer process improvement and yield improvement.
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