Investigation of Thermal Interface Materials to reduce contact resistance
碩士 === 國立交通大學 === 機械工程系所 === 107 === Advancement of the modern generation for fast, reliable and small computing devices has led to development of high power density per unit area. Most of this heat is to be dissipated using the various heat sinks. The unevenness or roughness of these surfaces offer...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/esexh4 |