| Summary: | 碩士 === 國立交通大學 === 電信工程研究所 === 107 === Heat pipe is a passive cooling solution for electronic systems and has excellent heat transfer ability to pull heat away from hot regions to cold regions. However, its heat transfer ability will be decreased by not only the number of bends but also bending degrees.
This work presents a multi-angle bended heat pipe routing mechanism for reducing the operating temperatures of handheld devices. First, we develop a compact thermal model for the multi-angle bended heat pipe and build an effective system-level thermal simulator. After that, in order to efficiently catch the heat transferring effect during the heat pipe routing procedure, we utilize the machine learning techniques to dynamically calculate the heat dissipation amount. Finally, we propose an X-architecture routing engine with the learning based dynamic thermal weight calculator to construct the heat pipe path. Compared to a commercial tool, ANSYS Fluent, the error of the thermal model is only 4.79%. The routing engine can efficiently reduce the operating temperatures of application processors at least 13.20% in smartphones.
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