Fabrication, characterization and application of highly (111)-oriented twinned gold film
碩士 === 國立交通大學 === 材料科學與工程學系奈米科技碩博士班 === 107 === Traditional solder joints form intermetallic compounds (IMCs) during the reflow process. Thus, they cannot be scaled below a pitch width of 10 m. The introduction of direct bonding into the field of electronic packaging is a step forward to solving th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/k6rg4x |