| Summary: | 碩士 === 國立交通大學 === 管理學院工業工程與管理學程 === 107 === Assembling process is a combination of carrier and wafer. Carrier transmits the signal from wafer to other components after assembling, wherein carriers act as a signal transmission. Therefore, the combination of the carrier and the wafer is one of the key factors that are indispensable for the assembling process. When assembling, it is necessary to point the colloid on carrier and then combine together. Since the position directly in contact with the colloid is solder resist on surface of carrier, the microscopic shape of the soldering surface is very important. It is one of the key factors affecting flow of colloid. In this study, various parameters are adjusted in the key factors of the solder resist process and the key factors affecting the surface roughness of solder resist are identified using Design of Experiment (D.O.E). Next, Response Surface Method (RSM) is applied to find the optimal factor-level combination. This practice enables the engineers to understand the clear direction and factors for improving the solder resist roughness, and to produce the soldering roughness that is most suitable for each assembly factory. Most of all, it can reduce customer complaints against solder resist and cost of material scrapping simultaneously.
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