| Summary: | 碩士 === 國立交通大學 === 管理學院工業工程與管理學程 === 107 === In recent years, governments around the world start placing a high value on automobile safety and legislating to make active and passive safety equipment the standard equipment,including TPES (Tire-pressure Monitoring System), ESP (Electronic Stability Program) and TCS
(Traction Control System), when customers purchase vehicles.The active and passive vehicle safety equipment uses a great amount of MEMS pressure sensors. Due to the fact that the wafer thickness of one certain type and one certain brand of MEMS pressure sensor is extremely thin and its structure is fragile, it is necessary to cover each wafer with an extra 400um wafer in the package in order to protect the finished product and prevent the wafer from the damage and the yield loss during the delivery. For this reason, the 400um wafer costs the most as the package material for the wafer of MEMS pressure sensors. If these 400um wafers undertaken by the cleaning process can remove particles effectively, then they can be recycled and be reused in the next package in the hope of reducing package cost. To increase the recovery rate of cleaned 400um wafer in the B MEMS Foundry, the study is going to discover possible cause making particles adhere to the 400um wafer during the cleaning process, adopt the 2k-1Fractional Factorial Design to create a plan of experiments,and obtain significant influence factors via ANOVA. Subsequently, the Central Composite
Design will be conducted in order to plan continuous factorial experiments and discover the optimum factors. Eventually, it shows that the particles adhering to the 400um wafer are effectively reduced during the experiments in combinations of optimum factors. If these
combinations can be introduced in the mass production, the recovery rate of 400um wafers can be increased effectively. The result of this study is going to not only improve the particle adherence problems of MEMS pressure sensor's packaging material- 400um wafer in order to achieve the purchasing cost reduction in enormous packages, but also provide MEMS foundries and companies with strategies for quality improvement as well as cost reduction.
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