Thickness Effects on System Performance of Flat Plate Oscillating Heat Pipe

• Main Authors: I-TingHuang, 黃逸廷
• Other Authors: Tzong-Shyng Leu
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/g4u8qk

碩士 === 國立成功大學 === 航空太空工程學系 === 107 === Oscillating heat pipe (OHP) is a two-phase flow heat transfer device that uses the phase change of the working fluid to transfer heat. This study shows that a copper flat plate oscillating heat pipe (FP-OHP) is used to visualize the flow phenomena and measure its thermal resistance. 25% and 50% of the working fluid filling ratio can be smoothly started, the thermal resistance also significantly decreasing with 120W power input. 75% of filling ratio system won’t be started until input power is increased to 160W.In addition,the concept of thermal resistance in parallel is used to analyze the heat conduction path in this study,and to understand ratio of heat conduction through the copper base plate as well as the working fluid. It can be found that the calculation results have a tendency conforming to the experimental results. Therefore,the ideal hypothesis can be used to make an analysis of the FP-OHP heat conduction path. Next,make the flat plate oscillating heat pipes with different base plate thickness to conduct the experiment and calculate the heat conduction path. It can be found that the Type 2 FP-OHP with a thinner thickness has a higher thermal resistance, but the heat transfer through the working fluid is higher than that of Type 1 FP-OHP.