Fracture Analysis and Improvement of Extra Thin QFN Electronic Package under Side Impact
碩士 === 國立成功大學 === 工程科學系碩士在職專班 === 107 === This research employs the finite element analysis software ANSYS to study the behavior in equipment manufacturing process, and mainly focuses on the comparison between the results of ANSYS simulation and actual experimental data. This research contains two p...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/w68g8g |