Heat Dissipation Model of a High-Power LED Headlamp for the Automobile

• Main Authors: Chun-Jui Lin, 林俊睿
• Other Authors: Ming-Tzer Lin
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/74rqec

碩士 === 國立中興大學 === 精密工程學系所 === 107 === With the improvement of LED packaging process capability and cost, and the advantages of high efficiency, long life, light and short, easy to design, etc., it has been widely used in automotive lighting sources in recent years, and has begun to replace the old halogen. The design and development of lamps and xenon headlamps has become the goal of active research by various manufacturers in the market in the future. However, due to the luminous efficiency and lifetime of the LED itself, it will decrease as the temperature of the wafer increases, and the package structure of the LED is not heat-resistant. When the junction temperature of the LED chip is too high, the wafer itself and the package tape will be come to permanent damage.Therefore, how to design an effective heat dissipation method to improve the LED luminous efficiency and life will be an important key to the application of high power LEDs. This study used computational fluid analysis software to analyze and heat-dissipate the original model of commercially available high-power LED headlamps. By adding the grooved heat pipe and the fan, and changing the material parameters of the LED package substrate and the circuit board, the change of the junction temperature of the LED chip is observed, and the heat dissipation efficiency of the heat dissipation module is discussed. The results show that under the forced convection, the heat transfer coefficient of the LED heat sink substrate and the PCB can be effectively reduced under the forced convection, so that the junction temperature of the LED chip can be effectively lowered, and the high-power LED headlight is safe. Maintain component reliability over temperature.