Improving Wafer Retesting Performance Using Greedy Algorithm
碩士 === 國立中興大學 === 資訊科學與工程學系所 === 107 === The technological advancements on integrated circuits (IC) drive the increasing of wafer size as well as the number of dies that can be put in a wafer. As a result, the costs of testing and retesting wafers also increase. Wafer test is divided into probing an...
Main Authors: | Kuang-Hung Cheng, 鄭光宏 |
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Other Authors: | 廖宜恩 |
Format: | Others |
Language: | zh-TW |
Published: |
2019
|
Online Access: | http://ndltd.ncl.edu.tw/handle/3rn6n8 |
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