Integrated analysis of surface oxide layers on cooper lead frames for microelectronic packaging
碩士 === 國立中興大學 === 材料科學與工程學系所 === 107 === Copper is the most commonly used conductor and metallization material. However, copper surface readily gets oxidizedduring fabrication and assembly processes, and thereby causes degradation in electrical conductance and even reliability problems. This study...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/u5n96v |