A Simulative Study on Invar Electrodeposition with Electroplating Tank
碩士 === 國立中興大學 === 化學工程學系所 === 107 === Nowadays, the fine metal mask required by the industry, deposited by Invar plating with a low thermal expansion coefficient and the thickness should be less than 30 μm with a unit plating deposition area of 200×700 mm2. Using the software to simulate the deposit...
Main Authors: | Yu-Chih Lee, 李有植 |
---|---|
Other Authors: | 張厚謙 |
Format: | Others |
Language: | zh-TW |
Published: |
2019
|
Online Access: | http://ndltd.ncl.edu.tw/handle/vry29z |
Similar Items
-
Electrodeposited Nanoscale Multilayers of Invar with Copper
by: Iyer, Diwakar Suryanarayana
Published: (2005) -
A Simulative Study on Copper Electrodeposition with Jet Electroplating Devices
by: Rung-Hsuan Ren, et al.
Published: (2018) -
Fabrication of super invar micro- and nano- structures by electrodeposition for low thermal expansion applications
Published: () -
The dimensional behavior of invar
by: Lement, Bernard Samuel
Published: (2015) -
Etching Properties of INVAR Plates
by: Dayu Lin, et al.
Published: (2001)