| Summary: | 碩士 === 龍華科技大學 === 機械工程系碩士班 === 107 === With the advancement of technology, the shrinking of electronic components has made the heat sources of all electronic products highly concentrated, making electronic products prone to high temperature overheating and reducing the service life. Therefore, heat dissipation has become a key point in the development of electronic products. A part of the consideration. The research direction of this paper is to improve the heat dissipation efficiency of the heat dissipation fins through the secondary processing method to achieve the optimized effect.
The experimental environment of this experiment was designed with the operating temperature of the Central Processing Unit (CPU) provided by Intel Corporation at 85 °C. After the heat balance was reached in the closed state, the heater was turned off and the fan was turned on to perform forced convection heat dissipation. The temperature of the bottom plate was recorded at 5/10/15/20 minutes, and the cooling curve of each sample was plotted.
In this experiment, there are three methods for secondary processing of heat sink fins, namely, diamond-like carbon (DLC) plating on the bottom plate, roughening of the surface of the cone-blasting sand, and three methods of combining the former two. According to the experimental results, in the mode of DLC plating on the bottom plate, the heat dissipation fins of the 950 nm DLC plated on the bottom plate have the best heat dissipation effect. In the mode of roughening the surface of the cone blasting sand, the heat dissipation fins of the blasting number 50 are used. The best combination of the best parameters of the former two can effectively improve the heat dissipation efficiency of the heat dissipation fins at room temperature 20±2°C, humidity 40±5% and forced convection by the fan. The 5 minute effect is most obvious.
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