Semiconductor Back-End Packaging Equipment Manufacturer Competition Strategy - G Companys as an Example
碩士 === 逢甲大學 === 經營管理碩士在職學位學程 === 107 === Wafer processing equipment will rise 11.7% in 2018 to $50.8 billion. Fab facilities equipment, wafer manufacturing, and mask/reticle equipment, are expected to grow 12.3% to $2.8 billion this year. The assembly and packaging equipment segment is projected to...
Main Authors: | LI, HUI-CHUAN, 李惠娟 |
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Other Authors: | YANG, KUEN-FENG |
Format: | Others |
Language: | zh-TW |
Published: |
2019
|
Online Access: | http://ndltd.ncl.edu.tw/handle/b6gs37 |
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