Board Test Technical Architecture and Implementation

碩士 === 中華大學 === 電機工程學系 === 107 === In the semiconductor industry competing environment, electronic products continue to improve complex and high-density technology, product testing due to the needs of different customers, the relative difficulty also has different levels of improvement, so in the pr...

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Bibliographic Details
Main Authors: CHANG,CHING-HE, 張清河
Other Authors: Lai,Chiun-Hui
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/8eh79n
Description
Summary:碩士 === 中華大學 === 電機工程學系 === 107 === In the semiconductor industry competing environment, electronic products continue to improve complex and high-density technology, product testing due to the needs of different customers, the relative difficulty also has different levels of improvement, so in the process of burn in, the use of burn-in oven to accelerate product aging to a stable period, Therefore, before the product is burn-in, it is necessary to ensure the proper rate of burn-in oven. By a variety of testing methods, we can find that the various links of burn-in are not sloppy, from the test results and set benchmarks to compare data with each other, to obtain a better quality test board for the production of the use of burn-in oven, can save the time of repeated waste in the burn-in process, And then can achieve rapid production and meet customer needs. The purpose of this thesis is to confirm that the test board meets the production demand before the burn-in, uses the test program and the load plate to do the test, and selects the test board suitable for the production, mainly takes the single board tester as the main body of the structure as the test flow, compares the different voltage, current and time, Filter out the good products we need for use in test boards, and construct a well-burn-in oven environment.