| Summary: | 碩士 === 國立臺北科技大學 === 能源與冷凍空調工程系 === 106 === In recent years, Taiwan semiconductor and optoelectronics industry has advanced to more precise and miniaturized devices. Improving the stability of environmental control has become a topic that the high-tech industry attaches great importance to. The final characteristics and yield rate of the product are to a great extent affected by temperature, humidity, pressure, air distribution and cleanliness etc. in the clean rooms. Maintaining a high degree of cleanliness and stability in a clean room depends greatly on the design of clean room configuration. Base on this concept, the study explores the effects of supply air plenum design factors. Particularly, on air flow distribution, air ventilation efficiency, and temperature and flow uniformity in a clean room. The object of this study is a semiconductor packaging and testing plant clean room. Computational fluid dynamics (CFD) and Taguchi method are used in the analysis and optimization of the flow field. The main design parameters in the air supply air plenum considered in this study are: (1) air supply plenum height, (2) make-up air outlet angle and (3) make-up air ratio (P_m). There are three factors and three levels considered in Taguchi analysis hence L9(3^3)orthogonal arrays has been chosen in this study. Improving the air flow distribution, temperature distribution, and ventilation efficiency has been discussed in the results. Characteristic of the air flow is quantified using indices such as air flow uniformity, temperature uniformity, and ventilation efficiency. Finally, Grey Relation Analysis is used as an indicator to determine the best level of factors in the simulation so to obtain an optimal result. The results show that the optimal factor levels are 30° for the fresh air outlet, 10% for the fresh air ratio, and 2.6m for the height of supply air plenum. The optimized results arrive at temperature uniformity of 1.33%, flow uniformity of 7.45%, and ventilation efficiency of 71.53%.
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