| Summary: | 碩士 === 國立臺北科技大學 === 資源工程研究所 === 106 === Polyethylene terephthalate (PET) has price advantage and strong corrosion resistance compared to other flexible plastic substrates. However, the plastic substrates are poor in hydrophilicity and heat resistance. In order to carry out the wet metallization process on plastic substrates, the appropriate surface treatment is important. In this study, the wettability of PET was increased by soaking in alkaline solutions and surface grinding. Furthermore, the silver and nickel were deposited on PET by chemical plating at 45°C with glucose and sodium hypophosphite as reducing agents, respectively, instead of toxic chemicals. In addition, the effects of various bath components, temperature and mass transfer on silver or nickel deposition were analyzed using electrochemical techniques. The results of plating film analysis showed that the sheet resistance of the deposited silver on PET was 14.09 mΩ/sq and the nickel/silver/PET was 92.53 mΩ/sq under optimum operating conditions. Moreover, this study used zinc to reduce nickel ion on PET and discussed the kinetic mechanism. Due to zinc with high activity, the activation energy of electroless nickel plating decreased. The order of the overall reaction is first-order known by simplified kinetic calculation. The research results of the various operation factors in this study are helpful for the applications on wet metallization of flexible plastic plates.
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