LGA Module Pre-tin Process Optimization - Example of Vehicle Communication Product
碩士 === 國立臺北科技大學 === 工業工程與管理系 === 106 === With the development science and technology, manufacturing technology in the electronics industry also progressed steadily, electronic products are also demanded toward miniaturization and versatility. Process optimization to increase product yield has always...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/5bpf93 |
| Summary: | 碩士 === 國立臺北科技大學 === 工業工程與管理系 === 106 === With the development science and technology, manufacturing technology in the electronics industry also progressed steadily, electronic products are also demanded toward miniaturization and versatility. Process optimization to increase product yield has always been a topic of concern to the industry. Pre-tin and Surface Mount Technology (SMT) are main processes for the assembly of printed circuit board (PCBA). Approximately 52% -71% percent of soldering defects are attributable to the solder paste printing process and lack of quality control problem.
This study employs Taguchi method in the parameter design at the initial development stage of vehicle communication module. Using solder paste volume standard deviation, coplanarity value, ball height range as responses. To consider about for printing quality influence of control factors, and the production environment influence of noise factors. The principal component gray relational analysis and TOPSIS analysis are applied to solve the multiple quality characteristics and determine the optimal process parameters. Let the optimal process parameters conduct Confirmation Test. The results showed that the calculation results are all within the range and represent the success of the experiment. The optimal process parameter can improve Pre-tin process printing stability.
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