Study of a Hybrid Robot-Laser Based Drilling System for Semiconductor Wafers
碩士 === 南臺科技大學 === 電機工程系 === 105 === At this stage of electronics evolution, semiconductor wafers are the most frequently used components. In the semiconductor industry, robots became the lifeline for production as well. In some way, processes for chip manufacturing are expensive, which is why we pre...
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ndltd-TW-106STUT04420092019-11-28T05:21:57Z http://ndltd.ncl.edu.tw/handle/427rh2 Study of a Hybrid Robot-Laser Based Drilling System for Semiconductor Wafers 機器手臂結合雷射之半導體晶圓鑽孔系統研發 Nirmal Kumar Chaturvedi 倪正文 碩士 南臺科技大學 電機工程系 105 At this stage of electronics evolution, semiconductor wafers are the most frequently used components. In the semiconductor industry, robots became the lifeline for production as well. In some way, processes for chip manufacturing are expensive, which is why we present a laser drilling system with ABB robot here. This process is economical in comparison to other existing systems. The main focus is to get high precision and decrease the cost of the system. In the existing system, high maintenance, complicated system, cost of purchase are some of the main problems. Therefore, in this thesis work, we try to overcome these problems. These robot laser drilling processes are better because of high efficiency, user-friendly, easy maintenance and low cost of installation. With these advantages, it can be easily upgraded in future. Here, we will try to overcome those problems during system design and installation. The main problem is to interface laser machine with the robot as they are from different companies. Therefore, we have to develop suitable circuits and programs in order to interface them together. During the installation process, some interesting and easy interfacing features are found in this thesis. It helps to make the process more user-friendly. While designing the system, different aspects between regular laser drilling machine and robots available in the market with our design system are studied. Experiments include some external parts design, software programming, robot programming and put them all together in order to achieve high accuracy and performance along with low cost. This thesis tries to understand the problem of working as a system of two different manufacturer’s digital machines. It will open a door to make cross interfacing easier and more economical. It will help us to learn the input and output relation between different machines and let us make a sustainable communication between them. In this thesis, a robot-laser drilling system is designed. The interfacing between robot and laser is done and tested successfully. Robot and laser are interconnected by the help of Arduino which provides a link of signal and data transfer between robot and laser controller. The data for laser parameter is saved in txt file which is processed by python and java programs and then further transferred to laser controller and robot. After design and assemble, the proposed system is used for drilling process on various wafers with different frequencies and power ratio. The results we get from these tests and experiments were satisfactory. Hung-Chi Yang 楊弘吉 2018 學位論文 ; thesis 57 en_US |
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碩士 === 南臺科技大學 === 電機工程系 === 105 === At this stage of electronics evolution, semiconductor wafers are the most frequently used components. In the semiconductor industry, robots became the lifeline for production as well. In some way, processes for chip manufacturing are expensive, which is why we present a laser drilling system with ABB robot here. This process is economical in comparison to other existing systems. The main focus is to get high precision and decrease the cost of the system. In the existing system, high maintenance, complicated system, cost of purchase are some of the main problems. Therefore, in this thesis work, we try to overcome these problems.
These robot laser drilling processes are better because of high efficiency, user-friendly, easy maintenance and low cost of installation. With these advantages, it can be easily upgraded in future. Here, we will try to overcome those problems during system design and installation. The main problem is to interface laser machine with the robot as they are from different companies. Therefore, we have to develop suitable circuits and programs in order to interface them together. During the installation process, some interesting and easy interfacing features are found in this thesis. It helps to make the process more user-friendly.
While designing the system, different aspects between regular laser drilling machine and robots available in the market with our design system are studied. Experiments include some external parts design, software programming, robot programming and put them all together in order to achieve high accuracy and performance along with low cost. This thesis tries to understand the problem of working as a system of two different manufacturer’s digital machines. It will open a door to make cross interfacing easier and more economical. It will help us to learn the input and
output relation between different machines and let us make a sustainable communication between them.
In this thesis, a robot-laser drilling system is designed. The interfacing between robot and laser is done and tested successfully. Robot and laser are interconnected by the help of Arduino which provides a link of signal and data transfer between robot and laser controller. The data for laser parameter is saved in txt file which is processed by python and java programs and then further transferred to laser controller and robot. After design and assemble, the proposed system is used for drilling process on various wafers with different frequencies and power ratio. The results we get from these tests and experiments were satisfactory.
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author2 |
Hung-Chi Yang |
author_facet |
Hung-Chi Yang Nirmal Kumar Chaturvedi 倪正文 |
author |
Nirmal Kumar Chaturvedi 倪正文 |
spellingShingle |
Nirmal Kumar Chaturvedi 倪正文 Study of a Hybrid Robot-Laser Based Drilling System for Semiconductor Wafers |
author_sort |
Nirmal Kumar Chaturvedi |
title |
Study of a Hybrid Robot-Laser Based Drilling System for Semiconductor Wafers |
title_short |
Study of a Hybrid Robot-Laser Based Drilling System for Semiconductor Wafers |
title_full |
Study of a Hybrid Robot-Laser Based Drilling System for Semiconductor Wafers |
title_fullStr |
Study of a Hybrid Robot-Laser Based Drilling System for Semiconductor Wafers |
title_full_unstemmed |
Study of a Hybrid Robot-Laser Based Drilling System for Semiconductor Wafers |
title_sort |
study of a hybrid robot-laser based drilling system for semiconductor wafers |
publishDate |
2018 |
url |
http://ndltd.ncl.edu.tw/handle/427rh2 |
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