Design and applications of improved Half HPL multilayers of High Aspect ratio PCB on Via plug Cantilever Probe Card
碩士 === 聖約翰科技大學 === 電機工程系碩士在職專班 === 106 === This thesis focuses on the hitches of welding assembly as to the Cantilever Probe Card on no-plug hole PCB. This work also employs the corresponding technology of PCB Via plug process proposing a design of improved Half HPL multilayers of High Aspect ratio...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/w6hqr5 |