| Summary: | 碩士 === 國立虎尾科技大學 === 光電工程系光電與材料科技碩士班 === 106 === The size of electronic products is becoming smaller and lighter and easier to carry today, but the computing power of the core processor is growing day by day. The heat generated from the CPU is likely to cause high temperature in the device. The performance, stability, lifespan, and user comfortability of electronic products could be reduced and even cause shot down of the system, since the thermal released from the CPU is accumulated quickly and difficult to dissipate from the electronic device. Therefore, how to remove the derived heat away from the heat source to avoid accumulation becomes quite important. In this study, we combined the electronic and phononic heat transfer mechanisms to increase the thermal conductivity of the composite coating films by filling a conductive polymer PEDOT between the BN, AlN, SiC micro-nano ceramic fillers gap. The heat is radiated from the surface of the composite films due to the high infrared emissivity fillers were connected by the conductive polymer. The highest thermal conductivity and the infrared emissivity of the composite coating can achieve 148.66 (W/M∙K) and 0.977, respectively. The results of this study also could be applied to the devices that are lightweight, fan-free or energy-efficient required devices in the future.
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