Examining a novel mold for use in electrowetting-assisted nanoimprint lithography

• Main Authors: Huang,Yi-Xuan, 黃意軒
• Other Authors: Hsu,Wei-Hsuan
• Format: Others
• Language: zh-TW
• Published: 2018
• Online Access: http://ndltd.ncl.edu.tw/handle/qmh2n9

碩士 === 國立聯合大學 === 機械工程學系碩士班 === 106 === In this study, a novel mold-filling method was proposed to improve the yield of nano-imprint process based on an electrowetting system created using a parallel electrode structure. During the nano-imprint process, mold filling and de-molding procedures are conducted to achieve a finished mold surface. Failure can occur if the employed photoresist fails to fully fill the mold cavity or if residual air remains in the mold cavity. In order to improve the yield and effectiveness of filling process, electrowetting is used to control the hydrophilicity and hydrophobicity of the mold surface. Both simulation and experiment confirmed the feasibility of the method. In the present study, a photocurable polymer resin was used in the nanoimprint process as an experimental material. A polydimethylsiloxane soft mold was chosen as the major batch mold and transferred directly to a surface-modified indium tin oxide–conductive glass substrate as the electrowetting mold. Under a controlled voltage, this mold could effectively control the shape of droplets of polymer light resin, and it also enabled the discharge of residual air. Electrowetting technology was confirmed as one of the optimal choice for mold cavity filling in nano-imprint processes.